Bücher von Michael (University of Maryland Pecht

Documents the technologies, capabilities, and infrastructure that has made China a major player in the Asian electronics industry. This book covers the major segments of China's electronics industry, including semiconductors, packaging, printed circuit boards, computer hardware and software, telecommunications, and electronic systems.

Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.