Bücher von Nirajkumar Mehta

This book comprises significance of material properties change on induction furnace wall. The Induction Furnace wall made up of alumina ramming mass is considered for this study. Wall of the induction furnace always stay with heat fluctuations during working that tends to thermal fatigue failure. The aim of this study is to prepare a Finite Element Model of furnace wall to check temperature distribution and thermal stress distribution fields by using Ansys finite element analysis software which describes relationship between stress life and material properties. From this study, we will also conclude about effect of material properties like Poisson¿s ratio & Elasticity Constant on the life cycle of induction furnace wall made up of alumina ramming mass. This analysis will describe direct or inverse proportionality of these material properties which affects the life cycle of induction furnace wall.

This book provides step by step recommendation to convert traditional lathe machine into CNC Machine. Nowadays, products can be produced by modern technology, which uses computer software and hardware in industries. It is desirable to use CNC machine to get more accurate dimensions and produce irregular shapes. It is conceivable to convert the conventional lathe machine into CNC machine by retrofitting. Developing and changing into CNC automatic lathe machine, there are three required portions; mechanical, electronics and hydraulic. In the present work, we have converted conventional lathe in to automatic CNC lathe by considering cost factor as limitation of work. In this experiment-based investigation work, we have substituted several components from conventional lathe by other valuable components & connect significant electronics parts. Therefore, all operations can be performed by controller. Therefore, machining time can be reduced and production rate can be increased. This book is targeting operators from small scale industries and students.

Due to rapid research in the electronics industry, including a dramatic increase in chip densities and power densities, as well as a continuous decrease in physical dimensions of electronic packages, thermal management is, and will continue to be, one of the most critical areas in electronic product development. It will have a significant impact on the cost, overall design, reliability and performance. The present trend in the electronics industry is to reduce the size and increase the performance of the equipment. The cooling rate of the modern electronic component is one of the prime areas for the application of thermal control techniques. In the present book, the effect of various shapes of cross sections of fins on the motherboard is studied keeping the inlet air velocity, the temperature of the ambient and the heat generation constant. Finite Element Analysis is done to get heat transfer and temperature distribution. This book will be useful for researchers doing research on computational heat transfer specifically for the electronics industry.