Bücher von Soha Hassoun

Research and development of logic synthesis and verification have matured considerably over the past two decades. Many commercial products are available, and they have been critical in harnessing advances in fabrication technology to produce today's plethora of electronic components. While this maturity is assuring, the advances in fabrication continue to seemingly present unwieldy challenges. Logic Synthesis and Verification provides a state-of-the-art view of logic synthesis and verification. It consists of fifteen chapters, each focusing on a distinct aspect. Each chapter presents key developments, outlines future challenges, and lists essential references. Two unique features of this book are technical strength and comprehensiveness. The book chapters are written by twenty-eight recognized leaders in the field and reviewed by equally qualified experts. The topics collectively span the field. Logic Synthesis and Verification fills a current gap in the existing CAD literature. Each chapter contains essential information to study a topic at a great depth, and to understand further developments in the field. The book is intended for seniors, graduate students, researchers, and developers of related Computer-Aided Design (CAD) tools. From the foreword: "e;The commercial success of logic synthesis and verification is due in large part to the ideas of many of the authors of this book. Their innovative work contributed to design automation tools that permanently changed the course of electronic design."e; by Aart J. de Geus, Chairman and CEO, Synopsys, Inc.

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.