Bücher der Reihe Electronics Handbook Series

Offering an overview of reliability principles, this book describes the steps essential to ensuring high reliability and minimum downtime. It examines heat management issues, grounding systems, and system tests and measurement. It also explores disaster planning and provides guidelines for keeping a facility running during a disaster.

This handbook examines the underlying technologies of each type of power vacuum tube device commonly in use today. It offers a comprehensive look at the important area of high-frequency/high-power applications of microwave power devices, making it possible for general principles to be translated to specific applications. Supporting mathematical equations and extensive technical illustrations and schematic diagrams help to explain the material more clearly. This third edition presents important updates on vacuum tube technology, devices, applications, design methods, and modulation methods. It also expands its scope to cover properties of materials and RF system maintenance and troubleshooting.

Presents the formulas used by electronic packaging and thermal engineers. This book presents heat transfer equations dealing with polyalphaolephin, silicone oils, perfluorocarbons, and silicate ester-based liquids. It presents empirical formulas and practical techniques that lets you solve thermal engineering problem in electronic packaging.

Today's marketplace demands product reliability. To meet these demands, product design requires a focused, streamlined, concurrent engineering process that can produce a product at the lowest cost in the least amount of time. This book provides an approach to the design process that is focused on reliability and based on the physics of failure.

Discusses the design, operation, and maintenance of high-power RF amplifiers, transmission lines, and antennas for broadcast, scientific, and industrial use. This handbook covers devices and systems producing at least one kW of RF output power. It includes a wide range of installations that use both semiconductor and vacuum tube technology.

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. This book offers an information on the design, manufacturing, and testing of electronic devices and systems. It addresses topics such as design automation, integrated circuit packaging technologies, materials, testing, and safety.

This handbook examines the underlying technologies of each type of power vacuum tube device commonly in use today. It offers a comprehensive look at the important area of high-frequency/high-power applications of microwave power devices, making it possible for general principles to be translated to specific applications. Supporting mathematical equations and extensive technical illustrations and schematic diagrams help to explain the material more clearly. This third edition presents important updates on vacuum tube technology, devices, applications, design methods, and modulation methods. It also expands its scope to cover properties of materials and RF system maintenance and troubleshooting.