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More-than-Moore Devices and Integration for Semiconductors

Über More-than-Moore Devices and Integration for Semiconductors

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

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  • Sprache:
  • Englisch
  • ISBN:
  • 9783031216091
  • Einband:
  • Gebundene Ausgabe
  • Seitenzahl:
  • 276
  • Veröffentlicht:
  • 18. Februar 2023
  • Ausgabe:
  • 23001
  • Abmessungen:
  • 160x21x241 mm.
  • Gewicht:
  • 582 g.
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Beschreibung von More-than-Moore Devices and Integration for Semiconductors

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems.

Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems;
Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources;
Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

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