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Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfacesvon Nicole Lindenmann
Über Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.

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  • Sprache:
  • Englisch
  • ISBN:
  • 9783731507468
  • Einband:
  • Taschenbuch
  • Seitenzahl:
  • 256
  • Veröffentlicht:
  • 12. Februar 2018
  • Abmessungen:
  • 148x16x210 mm.
  • Gewicht:
  • 376 g.
  Versandkostenfrei
  Versandfertig in 1-2 Wochen.
Verlängerte Rückgabefrist bis 31. Januar 2025

Beschreibung von Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.

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