Name: New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
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Author: Nabil Shovon Ashraf
ISBN: 9783031008993

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation von Nabil Shovon Ashraf

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Über New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

Sprache:
Englisch

ISBN:
9783031008993

Verlag:
Springer International Publishing

Einband:
Taschenbuch

Seitenzahl:
84

Veröffentlicht:
16. Februar 2016

Abmessungen:
191x6x235 mm.

Gewicht:
176 g.

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Beschreibung von New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

Über Nabil Shovon Ashraf

Beschreibung von New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

Kund*innenbewertungen von New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

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